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IC30 Series

Product Lineup

2.54mm Pitch Production IC Sockets for SIP or DIP

Features

・Two contact-springs ensuring high contact reliability
・End-to-end and/or side-to-side stackable with 2.54mm pitch
・RoHS compliant
IC30シリーズ

Type

Production IC Sockets

Product Specifications

Product Specifications
Title Requirement
Insulation Resistance 1,000MΩMin.
Withstanding Voltage 700V AC rms / minute
Contact Resistance 20mΩMax.
Current Rating 1A
Operating Temperature -65℃ to +85℃

Product NameList

Product Name Applicable Package Applicable ICP Pitch Row space of contacts Number of Pins (Contacts) PCB mounting method Plating Connector Types Remarks
IC30-0400-G4 SIP ---- 2.54mm Single Inline Package 4 DIP Gold plating Two contact-springs ----
IC30-0700-G4 SIP ---- 2.54mm Single Inline Package 7 DIP Gold plating Two contact-springs ----
IC30-0800-G4 SIP ---- 2.54mm Single Inline Package 8 DIP Gold plating Two contact-springs ----
IC30-0900-G4 SIP ---- 2.54mm Single Inline Package 9 DIP Gold plating Two contact-springs ----
IC30-1000-G4 SIP ---- 2.54mm Single Inline Package 10 DIP Gold plating Two contact-springs ----
IC30-1100-G4 SIP ---- 2.54mm Single Inline Package 11 DIP Gold plating Two contact-springs ----
IC30-1200-G4 SIP ---- 2.54mm Single Inline Package 12 DIP Gold plating Two contact-springs ----
IC30-1400-G4 SIP ---- 2.54mm Single Inline Package 14 DIP Gold plating Two contact-springs ----
IC30-1500-G4 SIP ---- 2.54mm Single Inline Package 15 DIP Gold plating Two contact-springs ----
IC30-1800-G4 SIP ---- 2.54mm Single Inline Package 18 DIP Gold plating Two contact-springs ----
IC30-2000-G4 SIP ---- 2.54mm Single Inline Package 20 DIP Gold plating Two contact-springs ----
IC30-2100-G4 SIP ---- 2.54mm Single Inline Package 21 DIP Gold plating Two contact-springs ----
IC30-0803-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 8 DIP Gold plating Two contact-springs ----
IC30-1003-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 10 DIP Gold plating Two contact-springs ----
IC30-1403-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 14 DIP Gold plating Two contact-springs ----
IC30-1603-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 16 DIP Gold plating Two contact-springs ----
IC30-1803-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 18 DIP Gold plating Two contact-springs ----
IC30-2003-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 20 DIP Gold plating Two contact-springs ----
IC30-2004-G4 DIP ---- 2.54mm Row space of IC-leads 0.4inch(10.16mm) 20 DIP Gold plating Two contact-springs ----
IC30-2203-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 22 DIP Gold plating Two contact-springs ----
IC30-2204-G4 DIP ---- 2.54mm Row space of IC-leads 0.4inch(10.16mm) 22 DIP Gold plating Two contact-springs ----
IC30-2403-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 24 DIP Gold plating Two contact-springs ----
IC30-2406-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 24 DIP Gold plating Two contact-springs ----
IC30-2803-G4 DIP ---- 2.54mm Row space of IC-leads 0.3inch(7.62mm) 28 DIP Gold plating Two contact-springs ----
IC30-2806-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 28 DIP Gold plating Two contact-springs ----
IC30-3206-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 32 DIP Gold plating Two contact-springs ----
IC30-3606-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 36 DIP Gold plating Two contact-springs ----
IC30-4006-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 40 DIP Gold plating Two contact-springs ----
IC30-4206-G4 DIP ---- 2.54mm Row space of IC-leads 0.6inch(15.24mm) 42 DIP Gold plating Two contact-springs ----
IC30-6409-G4 DIP ---- 2.54mm Row space of IC-leads 0.9inch(22.86mm) 64 DIP Gold plating Two contact-springs ----


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