Flexible Printed Boards (YFLEXTM) Product Details

Thin multilayer substrate


□ A multi-layer substrate with excellent high-frequency
□ Multi-layer substrate of the world's thinnest class
     (10 layers 0.45 mmt).     
□ Enabling all-layers random via connections, thus improving
     the degree of freedom of designing.     
□ Possible to use a bump connection method for board
     space reduction.


□ High-frequency PCB for ultra-high frequencies at 60 GHz or
□ Thin PCB with high-frequency characteristics
□ Replacement of flex rigid PCBs
□ Replacement of Teflon PCBs and ceramic PCBs

Cable Applications