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IC Sockets

SIP

IC26V Series

IC26 Series
Pitch 2.54mm
Contacts 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Features
  • Highly reliable four-point contact design
  • Machined sleeves eliminating solder or flux penetration
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IC30 Series

IC30 Series
Pitch 2.54mm
Contacts 4, 7, 8, 9, 10, 11, 12, 14, 15, 18, 20, 21
Features
  • Two contact-springs ensuring high contact reliability
  • End-to-end and/or side-to-side stackable with 2.54mm pitch
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DIP

IC26V Series

IC26 Series
Pitch 2.54mm
Contacts 6, 8, 10, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48
Features
  • Highly reliable four-point contact design
  • Machined sleeves eliminating solder or flux penetration
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IC30 Series

IC30 Series
Pitch 2.54mm
Contacts 8, 10, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 64
Features
  • Two contact-springs ensuring high contact reliability
  • End-to-end and/or side-to-side stackable with 2.54mm pitch
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SDIP

IC38 Series

IC38 Series
Pitch 1.778mm
Contacts 24, 28, 42, 64
Features
  • Two contact-springs ensuring high contact reliability
  • Shrink-pitch (1.778mm) suitable for high density mounting
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IC310 Series

IC310 Series
Pitch 1.778mm
Contacts 56
Features
  • Transparent resin being visible inside of the socket
  • Sn-plating for plating of solder terminal preventing IC-lead contacting different material plating
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PLCC

IC160 Series

IC160 Series
Pitch 1.27mm
Contacts 20, 28, 32, 44, 52, 68, 84
Features
  • Solder terminal available in three types: SMT lead-foot-patterned; Solder-terminal-out SMT; Straight solder dip
  • Low-profile design mountable on PCB at height 3.8-5.0mm (SMT) or 6.0mm (Solder dip)
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QFP

IC149 Series

IC149 Series
Pitch -
Contacts 44, 64, 80, 100, 112, 120, 132, 144, 160, 176, 208, 240
Features
  • QFP-test socket developed using Yamaichi Electronics expertise in Test & Burn-in IC socket production
  • Various emulation-probes available
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SOP

IC179 Series

IC179 Series
Pitch 1.27mm
Contacts 28, 32, 44
Features
  • Solder terminal: SMT lead-foot-patterned
  • Low-profile design mountable on PCB at height 3.9mm (for IC 28- or 32- lead; for others, 4.3mm)
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SSOP

IC306 Series

IC306 Series
Pitch 0.8mm
Contacts 70
Features
  • Wide-open cover enabling visual check of IC
  • Mis-insertion preventing mechanism employed for the cover
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IC307 Series

IC307 Series
Pitch 0.8mm
Contacts 88
Features
  • Designed for surface mounting
  • High contact reliability with gold plating
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