Flexible Printed Boards (YFLEX(TM))

YFLEX^TM

Flexible Printed Circuit Board (FPC) assembled with Liquid Crystal Polymer (LCP) as Dielectric Substrate
Excellent characters for loss properties in high frequency(HF) area and dimension stabilities realize accurate characteristic impedance matching for FPC.

●Gbps signal transmission
LCP as dielectric substrate, which has flat properties in low dielectric constant and low dissipation factors for broad frequency range, results low loss in signal transmission and extreme dimension stability in HF area. YFLEX realize Gbps signal transmission for FPC application.

●Low EMI
Accurate characteristic impedance matching based upon fine pattern etching technology and extreme dimension stabilities realize low EMI properties.

●Bump Build Up Process (Multilayer)
Bump build up process, laminate with conductive bumps for via connection, doesn’t need drilling and metal plating process. YFLEX realize accurate characteristic impedance matching with lower cost.

●Halogen Free Material
Assembled with halogen free material.

●Example for Application
Extreme in flexibility, bend formation or electronic device solder mounting are available. Differential High Frequency signal transmission for LVDS, PCI Express or others are already applied.

★We recommend HF connectors series designed for YFLEX connection system with Gbps signal transmission properties.