KGD carrier system
What is KGD carrier system?
With the increase of IC packages integrating multiple chips such as MCP, SiP and SDP, it is becoming more vital for semiconductor manufacturers to sort out defective chips before encapsulation.
The Yamaichi Electronics KGD carrier system enables semiconductor manufacturers to conduct test and burn-in processes on bare chips and eliminate defective chips before the packaging process, thus allowing them to substantially improve yield and cost performance.
KGD carrier system features
- Bump-sheet adopted for mating face with chips ensuring easy positioning and reliable contact
- Inserter/Remover equipment developed with equipment manufacturer adopting optical monitoring function for precise contact between chips and bump-sheet, soft mounting of chips, and quick and safe chip insertion/removal
- Design enabling safe and quick insertion/removal of IC chips onto/from the carrier